- • Ideally suited for both semiconductor and solar applications •
- •300mm round wafers/diagonal substrates processing capability •
- • May be configured for LPCVD, PECVD and atmospheric processes •
- • Accurate paddle/door positioning system •
- • Full end blocks to minimize heat loss •
- • Digital temperature and process controls •
- • Fully adjustable cantilever loaders •
- • Horizontal Laminar Flow available •
- • Mass flow controlled gas systems •
- • Fast response heating elements •
- • High thruput, up to 3,000 wph •
- • 40” (101cm) thermal flat zone •
- • Low process tube centerline •
- • Insulated quartz tube doors •
